Polymers represent another large area where thermal analysis finds strong applications. Thermoplastic polymers are commonly found in everyday packaging and household goods, but for raw material analysis, the effects of the many additives used (including stabilizers and colors) and fine tuning of the molding or extrusion process used can be achieved by using DSC. An example is oxidation induction time (OIT) by DSC, which can determine the amount of oxidation stabilizer present in a thermoplastic polymeric material (usually a polyolefin). Composition analysis is often performed using TGA, which can separate fillers, polymer resins, and other additives. TGA can also give an indication of thermal stability and the effects of additives, such as flame retardants.

Thermal analysis of composite materials, such as carbon fiber composites or glass epoxy composites, is often performed using DMA or DMTA, which can measure the stiffness of materials by determining the modulus and damping (energy absorption) properties of the material. Aerospace companies often employ these analyzers in routine quality control to ensure that products being manufactured meet required strength specifications. Formula 1 racing car manufacturers also have similar requirements. DSC is used to determine the curing properties of resins used in composite materials, and can also confirm whether a resin can be cured and the amount of heat that is generated during that process. The application of predictive kinetics analysis can help fine-tune manufacturing processes. Another example is that TGA can be used to measure the fiber content of composites by heating a sample to remove resin by applying heat and then determining the remaining mass.

The production of many metals (cast iron, gray iron, ductile iron, compacted graphite iron), 3000 series aluminum alloys, copper alloys, silver, and complex steels) is supplemented by a production technique also known as thermal analysis.[2] A sample of liquid metal is removed from the furnace or ladle and poured into a sample container with a built-in thermocouple. The temperature is then monitored and the arrests of the phase diagram (liquidus, eutectic and solidus "Solidus (thermodynamics)") are noted. From this information, the chemical composition can be calculated based on the phase diagram, or the crystal structure of the molded sample can be estimated, especially for the morphology of silicon in hypo-eutectic Al-Si alloys.[3] Strictly speaking, these measurements are cooling curves and a form of sample-controlled thermal analysis, so the cooling rate of the sample depends on the cup material (usually bound sand) and the volume of the sample, which typically It is a constant due to the use of standard size sample cups. To detect the phase evolution and the corresponding characteristic temperatures, the cooling curve and its first derivative curve must be considered simultaneously. Examination of the cooling curves and derivatives is performed using appropriate data analysis software. The process consists of plotting, smoothing and fitting the curve, as well as identifying reaction points and characteristic parameters. This procedure is known as computer-assisted cooling curve thermal analysis.[4]​.

Advanced techniques use differential curves to locate points of endothermic inflection, such as gas holes and contraction, or exothermic phases, such as carbides, beta crystals, crystalline copper, magnesium silicide, iron phosphide, and other phases as they solidify. Detection limits appear to be around 0.01% to 0.03% of volume.

Furthermore, the integration of the area between the zero curve and the first derivative is a measure of the specific heat of that part of the solidification that can lead to rough estimates of the volume percent of a phase. (Something must be known or assumed about the specific heat of the phase compared to the general specific heat.) Despite this limitation, this method is better than estimates from two-dimensional micro analysis, and much faster than chemical dissolution.

Most foods are subject to variations in temperature during production, transportation, storage, preparation and consumption, for example, pasteurization, sterilization (Sterilization (microbiology)), evaporation, cooking, freezing, refrigeration, etc. Temperature changes cause alterations in the physical and chemical properties of food components that influence the overall properties of the final product, for example, flavor, appearance, texture and stability. They can promote chemical reactions such as hydrolysis, oxidation or reduction, or physical changes, such as evaporation, melting, crystallization, aggregation or gelation. A better understanding of the influence of temperature on food properties allows food manufacturers to optimize processing conditions and improve product quality. Therefore, it is important for food scientists to have analytical techniques to monitor the changes that occur in foods when their temperature varies. These techniques are often grouped under the general heading of thermal analysis. In principle, most analytical techniques can be used, or easily adapted, to monitor the temperature-dependent properties of foods, e.g. spectroscopic (NMR, UV visible, IR spectroscopy, fluorescence), scattering (light, X-rays, neutrons), physical (mass, density, rheology, heat capacity) etc. However, today the term thermal analysis is generally reserved for a narrow range of techniques that measure changes in the physical properties of foods with temperature (TG/DTG, DTA, DSC, and transition temperature).

Power dissipation is an important issue in today's PCB design. Power dissipation will cause a temperature difference and pose a thermal problem for a chip. In addition to the reliability issue, excess heat will also negatively affect electrical performance and safety. Therefore, the working temperature of an IC must be kept below the maximum allowable limit in the worst case. Generally, the junction and ambient temperatures are 125°C and 55°C, respectively. The increasingly smaller chip size causes heat to be concentrated in a small area and leads to high power density. Furthermore, denser transistors packed into a monolithic chip and higher operating frequency cause worsening power dissipation. Removing heat effectively becomes the critical problem to solve.

Polymers represent another large area where thermal analysis finds strong applications. Thermoplastic polymers are commonly found in everyday packaging and household goods, but for raw material analysis, the effects of the many additives used (including stabilizers and colors) and fine tuning of the molding or extrusion process used can be achieved by using DSC. An example is oxidation induction time (OIT) by DSC, which can determine the amount of oxidation stabilizer present in a thermoplastic polymeric material (usually a polyolefin). Composition analysis is often performed using TGA, which can separate fillers, polymer resins, and other additives. TGA can also give an indication of thermal stability and the effects of additives, such as flame retardants.

Thermal analysis of composite materials, such as carbon fiber composites or glass epoxy composites, is often performed using DMA or DMTA, which can measure the stiffness of materials by determining the modulus and damping (energy absorption) properties of the material. Aerospace companies often employ these analyzers in routine quality control to ensure that products being manufactured meet required strength specifications. Formula 1 racing car manufacturers also have similar requirements. DSC is used to determine the curing properties of resins used in composite materials, and can also confirm whether a resin can be cured and the amount of heat that is generated during that process. The application of predictive kinetics analysis can help fine-tune manufacturing processes. Another example is that TGA can be used to measure the fiber content of composites by heating a sample to remove resin by applying heat and then determining the remaining mass.

The production of many metals (cast iron, gray iron, ductile iron, compacted graphite iron), 3000 series aluminum alloys, copper alloys, silver, and complex steels) is supplemented by a production technique also known as thermal analysis.[2] A sample of liquid metal is removed from the furnace or ladle and poured into a sample container with a built-in thermocouple. The temperature is then monitored and the arrests of the phase diagram (liquidus, eutectic and solidus "Solidus (thermodynamics)") are noted. From this information, the chemical composition can be calculated based on the phase diagram, or the crystal structure of the molded sample can be estimated, especially for the morphology of silicon in hypo-eutectic Al-Si alloys.[3] Strictly speaking, these measurements are cooling curves and a form of sample-controlled thermal analysis, so the cooling rate of the sample depends on the cup material (usually bound sand) and the volume of the sample, which typically It is a constant due to the use of standard size sample cups. To detect the phase evolution and the corresponding characteristic temperatures, the cooling curve and its first derivative curve must be considered simultaneously. Examination of the cooling curves and derivatives is performed using appropriate data analysis software. The process consists of plotting, smoothing and fitting the curve, as well as identifying reaction points and characteristic parameters. This procedure is known as computer-assisted cooling curve thermal analysis.[4]​.

Advanced techniques use differential curves to locate points of endothermic inflection, such as gas holes and contraction, or exothermic phases, such as carbides, beta crystals, crystalline copper, magnesium silicide, iron phosphide, and other phases as they solidify. Detection limits appear to be around 0.01% to 0.03% of volume.

Furthermore, the integration of the area between the zero curve and the first derivative is a measure of the specific heat of that part of the solidification that can lead to rough estimates of the volume percent of a phase. (Something must be known or assumed about the specific heat of the phase compared to the general specific heat.) Despite this limitation, this method is better than estimates from two-dimensional micro analysis, and much faster than chemical dissolution.

Most foods are subject to variations in temperature during production, transportation, storage, preparation and consumption, for example, pasteurization, sterilization (Sterilization (microbiology)), evaporation, cooking, freezing, refrigeration, etc. Temperature changes cause alterations in the physical and chemical properties of food components that influence the overall properties of the final product, for example, flavor, appearance, texture and stability. They can promote chemical reactions such as hydrolysis, oxidation or reduction, or physical changes, such as evaporation, melting, crystallization, aggregation or gelation. A better understanding of the influence of temperature on food properties allows food manufacturers to optimize processing conditions and improve product quality. Therefore, it is important for food scientists to have analytical techniques to monitor the changes that occur in foods when their temperature varies. These techniques are often grouped under the general heading of thermal analysis. In principle, most analytical techniques can be used, or easily adapted, to monitor the temperature-dependent properties of foods, e.g. spectroscopic (NMR, UV visible, IR spectroscopy, fluorescence), scattering (light, X-rays, neutrons), physical (mass, density, rheology, heat capacity) etc. However, today the term thermal analysis is generally reserved for a narrow range of techniques that measure changes in the physical properties of foods with temperature (TG/DTG, DTA, DSC, and transition temperature).

Power dissipation is an important issue in today's PCB design. Power dissipation will cause a temperature difference and pose a thermal problem for a chip. In addition to the reliability issue, excess heat will also negatively affect electrical performance and safety. Therefore, the working temperature of an IC must be kept below the maximum allowable limit in the worst case. Generally, the junction and ambient temperatures are 125°C and 55°C, respectively. The increasingly smaller chip size causes heat to be concentrated in a small area and leads to high power density. Furthermore, denser transistors packed into a monolithic chip and higher operating frequency cause worsening power dissipation. Removing heat effectively becomes the critical problem to solve.